RIEGL to Exhibit and Present at SPAR 3D Expo & Conference 2018
Written by RIEGL   
Friday, 01 June 2018

May 29, 2018

RIEGL to Exhibit and Present at SPAR 3D Expo & Conference 2018!

RIEGL will be exhibiting and presenting at SPAR 3D Expo & Conference 2018!

SPAR 3D 2018 will be held at the Anaheim Convention Center in Anaheim, California from June 5-7, 2018.

RIEGL will be exhibiting at Booth 501 during the conference. Be sure to stop by our booth to learn about the latest developments in RIEGL Waveform-LiDAR technology and how we can help you and your business!

Meet with our team of RIEGL experts at our booth throughout the week and see our RIEGL instruments in person: the RIEGL VZ-400i, the RIEGL VZ-2000i, the RIEGL VMX-2HA, the RIEGL miniVUX-1DL, and the RIEGL miniVUX-1UAV, integrated on a DJI-M600 with the RIEGL Integration Kit 600.

The VZ-400i is a cutting-edge, ultra high performance 3D terrestrial laser scanning system that is redefining productivity through the combination of future-oriented, innovative processing architecture and internet connectivity with RIEGLís latest waveform processing LiDAR technology.

The VZ-2000i is a long range, very high speed 3D terrestrial laser scanning system that combines proven user friendliness in the field with fast and highly accurate data acquisition.

The VMX-2HA is a high speed, high performance dual scanner mobile mapping system which provides dense, accurate, and feature-rich data at highway speeds. With two million measurements and five hundred scan lines per second, this turnkey solution is ideally suited for survey-grade mobile mapping applications.

The miniVUX-1DL is a downward-looking LiDAR sensor for unmanned laser scanning with a special design that is tailored to meet the needs of corridor mapping tasks through its downward looking capability, its optimized field of view, and its small size.

The miniVUX-1UAV is a user-friendly and cost-efficient miniaturized LiDAR sensor for unmanned laser scanning used to acquire survey-grade measurement data through the use of remotely piloted multi-rotor, rotary-wing, or fixed-wing UAVís for a variety of applications. The miniVUX-1UAV will be on display while integrated into a DJI-M600 with the RIEGL Integration Kit 600.

In addition to our exhibition at SPAR 3D 2018, we will be presenting a workshop at the conference!

Join our team of RIEGL experts on Tuesday, May 5 from 9:30 AM-12:00 PM in Room 304A on the third level at the Anaheim Convention Center to learn about acquisition tips on VZ-400i workflows, RiSOLVE and forensic scanning, advanced processing in RiSCAN PRO, exporting to RiPROCESS, and more!

RIEGL is looking forward to a successful conference and to welcoming you to the SPAR 3D Expo & Conference 2018!



About RIEGL:

Celebrating 40 years in 2018, RIEGL is an international leading provider of cutting edge technology in airborne, mobile, terrestrial, industrial and unmanned laser scanning solutions.

RIEGL has been producing LiDAR systems commercially for 40 years and focuses on pulsed time-of-flight laser radar technology in multiple wavelengths.

RIEGLís core Smart-Waveform technologies provide pure digital LiDAR signal processing, unique methodologies for resolving range ambiguities, multiple targets per laser shots, optimum distribution of measurements, calibrated amplitudes and reflectance estimates, as well as the seamless integration and calibration of systems.

RIEGLís various 3D scanners offer a wide array of performance characteristics and serve as a platform for continuing ĒInnovation in 3DĒ for the LiDAR industry.

From the first inquiry, to purchase and integration of the system, as well as training and support, RIEGL maintains an outstanding history of reliability and support to their customers.

Worldwide sales, training, support and services are delivered from RIEGLís headquarters in Austria, main offices in the USA, Japan, and China, and by a worldwide network of representatives covering Europe, North and South America, Asia, Australia, and Africa.